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TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)

01/16/2025 | TopLine Corporation
TopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Austin Expo & Tech Forum

01/16/2025 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Austin Expo & Tech Forum taking place on February 6 at the Travis County Exposition Center in Austin, Texas.

Indium Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025

01/16/2025 | Indium Corporation
Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.

ELMOTEC to Showcase SolderSmart® TOP Automated Soldering Equipment at APEX 2025

01/15/2025 | ELMOTEC
E-tronix, a Stromberg Company, is excited to announce that they will partner with ELMOTEC to showcase the SolderSmart® TOP Automated Soldering Equipment at APEX 2025 Booth #1703.

AIM to Participate in SMTA Ultra High Density Interconnect Symposium

01/15/2025 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona.
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