Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

I-Connect007 Releases New Guide Expanding on Qnity’s Engineering What’s Next Podcast Series

10/26/2026 | I-Connect007
I-Connect007 is pleased to announce the release of Engineering What’s Next: A Companion Guide to Qnity’s Advanced Electronics Podcast Series, a new publication that expands on the insights shared in the six-part series. As artificial intelligence, advanced packaging, and next-generation electronics continue to transform the industry, engineers face increasingly complex challenges in performance, reliability, thermal management, and sustainability. This guide explores why advanced materials—and the expertise to integrate them into practical solutions—are essential to meeting these demands.

HDP Welcomes Nittobo as New Member

10/21/2026 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that Nittobo has become a member.

Neways, SRC Partner on Advanced European Defense Technology

10/20/2026 | Neways
Neways, the global innovator in mission-critical technology for leading semicon, defense & mobility, and connectivity companies, has signed an agreement with SRC, Inc., a not-for-profit U.S. research and development corporation specializing in developing, manufacturing and servicing advanced defense technologies.

Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.

Infineon Showcases AI-Era Technologies at electronica 2026

10/14/2026 | Infineon
With artificial intelligence evolving from virtual chatbots into real-world machines and devices, it will shape our lives more than ever.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in