-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Aspocomp’s Shareholders’ Nomination Board’s proposals to the Annual General Meeting 2025
December 19, 2024 | AspocompEstimated reading time: 2 minutes
The Shareholders’ Nomination Board of Aspocomp Group Plc submits the following proposals to the Annual General Meeting, planned to be held on April 29, 2025. The proposals will also be included in the Notice to the Annual General Meeting 2025 to be published at the later date.
Number of Board members
The Shareholder’s Nomination Board proposes to the Annual General Meeting that four members be elected to the Board of Directors.
Members of the Board of Directors
The Shareholder’s Nomination Board proposes to the Annual General Meeting that the current members of the Board of Directors Mr. Anssi Korhonen and Mr. Ville Vuori be re-elected as members to the Board of Directors and Ms. Jenni Enroth and Ms. Kaisa Kokkonen be elected as new members of the Board of Directors. In accordance with the Articles of Association of the company, the term of office of the members of the Board of Directors ends at the closing of the next Annual General Meeting following the election.
The said director nominees have given their consent to the election. The current members of the Board of Directors Päivi Marttila, Kaarina Muurinen and Jukka Huuskonen, have informed that they are not available for re-election.
Presentations of the proposed new members of the Board of Directors Jenni Enroth and Kaisa Kokkonen are attached to this stock exchange release. The proposed current members of the Board of Directors are presented on Aspocomp’s website.
The Nomination Board has assessed the director nominees’ independence against the independence criteria of the Finnish Corporate Governance Code. According to the evaluation carried out by the Nomination Board, all director nominees are independent of the company’s significant shareholders. The Nomination Board has also assessed that all nominees are independent of the company.
Board remuneration
Shareholder’s Nomination Board proposes to the Annual General Meeting that the amount of remuneration payable to the Board of Directors remain the same as in the ending term and that Board Members be thus compensated as follows: EUR 30,000 for the chairman of the Board of Directors, EUR 20,000 for the vice chairman, and EUR 15,000 for each of the other members in remuneration for their term of office. The Nomination Board further proposes that EUR 1,000 be paid as remuneration per meeting to the chairman and that the other members be paid EUR 500 per meeting of the Board and its committees. The Nomination Board also proposes that the members of the Board of Directors be reimbursed for reasonable travel costs. The Nomination Board further proposes that earning-related pension insurance contributions are paid voluntarily for the paid remuneration.
Composition of Shareholder’s Nomination Board
Aspocomp’s Shareholders’ Nomination Board consists of three members who represent the company’s three largest shareholders. In addition, the Chairman of the company’s Board of Directors shall serve as an expert member of the Nomination Board unless he or she is appointed as an ordinary member of the Board. The three largest shareholders are determined annually based on the ownership information registered with the company’s shareholders’ register on the first business day of September.
The Shareholder’s Nomination Board, which prepared the proposals for the Annual General Meeting 2025, includes the following members: Ms. Päivi Marttila, appointed by Etola Group and Erkki Etola, Mr. Kyösti Kakkonen, appointed by Joensuun Kauppa ja Kone Oy and Mr. Mikko Montonen, Aspocomp’s third largest shareholder.
Päivi Marttila did not participate in the decision-making concerning the remuneration of the Board members.
Suggested Items
Upcoming SMTA UHDI Symposium: Shortening the Learning Curve
01/15/2025 | Marcy LaRont, I-Connect007SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
01/14/2025 | Happy Holden -- Column: Happy’s Tech TalkDr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment
01/07/2025 | PRNewswireSparkFun Electronics, a leader in open-source embedded electronics, and Digi International ®, a leading global provider of complete end-to-end Internet of Things (IoT) connectivity products, solutions and services, announce the launch of a collaborative new development board, the SparkFun IoT Node for LoRaWAN®, as well as two kits, one each for North America and Europe, the SparkFun Digi X-ON™ Kit for LoRaWAN®
Amar Maletira Appointed to Celestica’s Board of Directors
01/07/2025 | CelesticaCelestica Inc., a leader in design, manufacturing, hardware platform and supply chain solutions for the world’s most innovative companies is pleased to announce the appointment of Amar Maletira to its Board of Directors, effective January 1, 2025.