-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
PCB Fabricator Cistelaier Receives ESA Qualification
December 16, 2024 | CistelaierEstimated reading time: 1 minute
The capability and independence of its space industry are strategic for Europe, and the European Space Community needs a qualified, resilient supply chain with adequate production capacity. Specifically, it requires greater production capacity in PCB manufacturing.
On this premise, in early 2020, Cistelaier began the process of obtaining an ESA qualification.
Today, after much effort and dedication of resources, we are pleased to inform you that on October 3, 2024, the European Space Agency formally recognized Cistelaier with ESA qualification for the production of:
- Sequential rigid polyimide PCBs according to PID_v05
- Rigid-flex polyimide PCBs according to PID_v05
in accordance with the ECSS-Q-ST-70-60C standard.
Cistelaier thus becomes the first Italian PCB manufacturer qualified by ESA according to the ECSS-Q-ST-70-60C standards and, to date, the only Italian manufacturer qualified by ESA.
Cistelaier S.p.A. will use its expertise and production capacity to support the European Space Community's current and future programs.
This ESA qualification is what we call "Phase A" of a broader project. "Phase B will involve extending our current PID, and Phase C will allow us to "qualify the state of the art of rigid HDI PCBs based on polyimide material for space applications."
To this end, Cistelaier has already submitted a project to ESA within the General Technology Support Program.
Suggested Items
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
01/16/2025 | TopLine CorporationTopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.
Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation
01/14/2025 | Merlin Circuit TechnologyMerlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.
Global PCB Connections: The Future of HDI PCBs
01/16/2025 | Jerome Larez -- Column: Global PCB ConnectionsHigh-density interconnect (HDI) printed circuit boards (PCBs) transform modern electronics by providing increased functionality, reduced sizes, and enhanced performance in complex designs. They do so by using advanced techniques, such as finer line and space definitions, microvias, and additional board layers. Specialized via structures—namely blind, buried, and stacked vias—offer complex routing while conserving space. This allows for the development of highly compact electronic devices. This article delves into HDI PCB technology, the function and benefits of blind, buried, and stacked vias, and their impact on PCB performance and design.
NASA’s Kennedy Marks New Chapter for Florida Space Industry
01/09/2025 | NASAThe future of research and technology at NASA’s Kennedy Space Center in Florida is expanding Wednesday, as Kennedy’s center director and charter members in the Florida University Space Research Consortium signed a memorandum of understanding in research and development to assist with missions and contribute to NASA’s Moon to Mars exploration approach.
AST SpaceMobile Secures 45 MHz of Lower Mid-Band Spectrum in the U.S.
01/09/2025 | BUSINESS WIREAST SpaceMobile, Inc., the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones, designed for both commercial and government applications, today announced an agreement for long-term access to up to 45 MHz of lower mid-band spectrum in the United States for direct-to-device satellite applications.