-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
ESCATEC Appoints Steven Waterston to Lead Mechatronics Sales
November 20, 2024 | ESCATECEstimated reading time: 1 minute
Growth-focused, electronics manufacturing services (EMS) provider, ESCATEC, has appointed industry veteran Steven Waterston as a Director of Business Development, effective immediately. He will lead ESCATEC’s initiatives to secure new mechatronics projects globally, by leveraging on the Group’s expertise and technical capabilities in meeting the needs of OEMs in this market segment.
Waterston brings 24 years of experience in the EMS industry and 14 years in semiconductor manufacturing, and was recently Senior Director of Business Development at Flex within their Industrial Business Unit focused on capital equipment manufacturing. He has a strong reputation for driving sales growth and building successful cross-border sales teams, with extensive experience in contract and financial negotiations.
“We are delighted to have Steven join us,” said ESCATEC CEO Charles-Alexandre Albin, “his expertise will enable ESCATEC to deliver increasingly complex projects and to strengthen partnerships with OEMs who require high-performance and cost-efficient mechatronics solutions.”
Waterston’s appointment underscores ESCATEC’s commitment to investing in exceptional talent and supporting OEMs with innovative and scalable solutions that drive market success.
ESCATEC offers a full value chain of EMS services, from D&D to product certification to mass manufacturing and after-sales services, ranging across electronics, mechatronics, machining, MOEMS, box build, and plastic moulding. The Group’s integrated production network encompasses four facilities in Malaysia, two at Chomutov in the Czech Republic, one in Lutterworth in the United Kingdom, one at Plovdiv in Bulgaria, and an advanced microelectronics facility in Heerbrugg, Switzerland. It also has a Design & Development (D&D) Centre in Switzerland and strategic partnerships in Croatia and the United States.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.