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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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BEST Inc. Offers Interposer Rework and Precision Solder Ball Attachment Services

09/01/2026 | BEST Inc.
BEST Inc., a leader in electronic component and PC services, is pleased to announce they offer interposer rework and precision solder ball attachment services. Interposer rework is an advanced process used to repair, replace, or modify the interposer that connects critical electronic components within high density assemblies.

September SMT007 Magazine Examines Mexico’s Manufacturing Growth

09/01/2026 | I-Connect007 Editorial Team
Mexico is playing an increasingly important role in North American electronics manufacturing as companies invest in new capacity, reconsider sourcing strategies, and implement nearshoring plans. The September 2026 issue of SMT007 Magazine examines what’s behind this investment and what it means for the broader electronics supply chain. Through perspectives from companies operating and investing in Mexico, we explore trade considerations, manufacturing capabilities, and the opportunities and challenges of building a stronger regional supply chain.

Foxconn Expands U.S. AI Footprint With California Property Acquisition

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Foxconn is expanding its U.S. presence with the acquisition of land and a manufacturing facility in Santa Clara, California, as the electronics manufacturing giant continues to invest in AI-related business.

Incap Germany Expands Soldering with SEHO SelectLine-C 500

08/18/2026 | Incap
Incap Germany has further expanded its selective soldering capabilities with the commissioning of a new SEHO SelectLine-C 500.

Incap Launches Up to €15M Share Buyback Programme

08/11/2026 | Incap
The Board of Directors of Incap Corporation has decided to initiate a share buyback programme based on the authorisation given by the Annual General Meeting held on 20 May 2026.
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