AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum

November 14, 2024 | AIM

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AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Silicon Valley Expo & Tech Forum on December 5.

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