Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies

04/27/2026 | Nolan Johnson, I-Connect007
This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.

Zhen Ding Recognized with Dual 'A' Ratings by CDP

04/16/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leader in the PCB industry, received the highest “A” rating in both Climate Change and Water Security in the 2025 CDP assessment.

HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots

04/15/2026 | PRNewswire
HYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.

Fuse Expands U.S. Radiation Testing Capacity with New Albuquerque Facility

04/13/2026 | PRNewswire
Fuse, a leading U.S.-based fusion company, announced the establishment of a new state-of-the-art facility in Albuquerque, New Mexico that will expand U.S. radiation effects testing capacity for critical defense, space, and semiconductor technologies.

Microchip Earns IEC 62443-4-1 ML2 Industrial Automation and Control System Certification

04/08/2026 | Microchip
As connected systems spread across residential, industrial and commercial environments, the need for independently verified cybersecurity assurance is becoming a core requirement.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in