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PAC-3 Engages Advanced Target in Flight Test Supporting U.S. Army Modernization Strategy
November 5, 2024 | Lockheed MartinEstimated reading time: 1 minute
Lockheed Martin’s Patriot Advanced Capability – 3 (PAC-3) missile successfully integrated with Raytheon’s Lower Tier Air and Missile Defense Sensor (LTAMDS) radar to defeat an advanced Tactical Ballistic Missile (TBM). The test validated advanced software updates that ensures PAC-3 can defeat evolving threats within the U.S. Army’s modernized Integrated Air and Missile Defense (IAMD) architecture.
During the flight test at White Sands Missile Range, PAC-3 Missile Segment Enhancement (MSE) and Cost Reduction Interceptor (CRI) confirmed the ability to detect, acquire, track and engage an advanced TBM target. The interceptors were shot in a ripple configuration and successfully engaged and intercepted the TBM target.
“Integrating PAC-3 with new, advanced systems to deliver next-generation deterrence capability is a critical piece of the U.S. Army’s modernization strategy,” said Brian Kubik, vice president of PAC-3 Programs. “This is 21st Century Security® in action – by harnessing digital technologies to network platforms together, Lockheed Martin is increasing the effectiveness and deterrent value of defense solutions for our customers, ensuring they have the technology needed to stay ahead in an evolving threat environment.
To prepare for today’s flight test, Lockheed Martin partnered with the U.S. Army to conduct a series of ground testing and captive carry tests. This builds upon previously demonstrated PAC-3 capability with the U.S. Army’s Integrated Battle Command System (IBCS) and LTAMDS radar.
PAC-3 uses Hit-to-Kill technology to defend against threats through direct body-to-body contact that delivers exponentially more kinetic energy on the target than can be achieved with blast-fragmentation mechanisms. PAC-3 is effective against current and evolving threats including aircraft, tactical ballistic missiles, advanced threats including hypersonics, and cruise missiles.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets
11/21/2024 | Keysight TechnologiesKeysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Würth Elektronik Expands Signal LED Product Range
11/21/2024 | Wurth ElectronicsWürth Elektronik expands its proven LED product series WL-SMCW and WL-SMCC with white LEDs in 0603 and 0402 packages.
Global Semiconductor Manufacturing Industry Records Strong Growth in Q3 2024
11/20/2024 | SEMIThe global semiconductor manufacturing industry in the third quarter of 2024 showed strong momentum with all key industry indicators performing positive quarter-on-quarter (QoQ) increases for the first time in two years.