The Marketing Minute: A Brand Visibility Playbook—Get Seen, Heard, and Remembered
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
Würth Elektronik Expands Its FPC Connector Family
October 30, 2024 | Würth ElektronikEstimated reading time: Less than a minute
The selection of connectors for flat flexible cables (FFC) and flexible printed circuits (FPC) from Würth Elektronik is getting even larger. The manufacturer of electronic and electromechanical components now offers WR-FPC ZIF connectors (Zero Insertion Force) with locking mechanism, and featuring gold-plated contacts. Gold over nickel on the connector strip improves electrical conductivity, wear resistance, corrosion resistance, and reliability. The new variant is primarily aimed at connecting flexible printed circuits.
The mechanical properties and polarity of the gold-plated connectors are identical to the standard series with tin plating, so no design changes are required if a customer wishes to upgrade. In addition to improved conductivity and signal quality, the FPC connectors offer another advantage: FPCs usually have gold-plated contacts. The new connectors avoid mixing gold and tin in the transition zone. Gold and tin form an electrochemical series, which can cause corrosion and limit the service life of the connection. It is therefore recommended to ensure that gold is combined with gold and tin with tin on the contact surfaces.
Share on:
Suggested Items
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
Electroninks Acquires Complete UTDots Advanced Materials Nanoinks Portfolio and IP
05/19/2025 | ElectroninksElectroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications.
SAMI-AEC Earns Gold Membership Under 'Made in Saudi' Program
05/19/2025 | SAMI-AECSAMI Advanced Electronics Company (SAMI-AEC) proudly announces its elevation to the prestigious Gold Category within the “Made in Saudi” program.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.