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PCB Technologies to Exhibit at PCB East 2026

04/23/2026 | PCB Technologies Ltd.
Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.

Design for Test: A New Book from The Test Connection, Inc.

04/23/2026 | Real Time with... APEX EXPO
Bert Horner, president of The Test Connection Inc., shares insights on designing for testability (DFT) challenges with Kelly Dack. Horner discusses the critical need for incorporating testability early in the design process and the importance of quantifiable metrics for measuring test coverage. He highlights The Test Connection's role in transferring decades of 'tribal knowledge' to emerging engineers through training and education. Look for "The Printed Circuit Assembler's Guide to... Design for Test, A Practical Guide to Test and Inspection" in the I-007eBooks library.

Changing Times: Siemens Plans to Sell Former Mentor Graphics Wilsonville Campus

04/22/2026 | Nolan Johnson, I-Connect007
Siemens announced it will be selling its Wilsonville, Oregon, property, which has served as the campus for Mentor Graphics, which was later acquired by German EDA-giant Siemens, as reported by The Oregonian on April 20. Siemens will maintain one building on the sprawling 53-acre campus, citing the move to hybrid and remote work over the past few years as a key factor in the decision.

Siemens Collaborates with TSMC to Advance AI for Semiconductor Design

04/22/2026 | Siemens
Siemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.

Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3

04/22/2026 | Anaya Vardya, American Standard Circuits
Parts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.
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