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Advanced Electronics Packaging Digest

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Siemens to Acquire Defacto Technologies to Bolster EDA Portfolio

07/21/2026 | Siemens
Siemens announced that it has entered into an agreement to acquire Defacto Technologies, a privately held EDA software company active in the register-transfer level (RTL) design field focused on automated SoC design creation and integration.

Foxconn Debuted Smart EVs and AI Modular Data Center at Japan-Taiwan Exhibition

07/21/2026 | Foxconn
Organized by the Foreign Trade Administration of Taiwan's Ministry of Economic Affairs and run by the Taiwan External Trade Development Council, the 2026 Japan-Taiwan Image Exhibition carried the theme "Innovate for Tomorrow: Taiwan and Japan Creating a Better Future Together."

Siemens to Acquire Precision Innovations to Expand AI-Powered Chip Design Optimization

07/20/2026 | Siemens
Siemens announced that it has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software company, expanding Siemens’ EDA portfolio with AI-powered chip planning capabilities that help semiconductor teams optimize power, performance and area earlier in the system-on-chip design process.

Foxconn Debuted EVs, AI Data Center at Japan-Taiwan Exhibition

07/20/2026 | Foxconn
Organized by the Foreign Trade Administration of Taiwan's Ministry of Economic Affairs and run by the Taiwan External Trade Development Council, the 2026 Japan-Taiwan Image Exhibition carried the theme "Innovate for Tomorrow: Taiwan and Japan Creating a Better Future Together.

Rapidus, Cadence Partner on Agentic AI for Advanced SoC Design

07/20/2026 | Cadence Design Systems
Rapidus Corporation and Cadence announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence® InnoStack™ AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads).
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