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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Polar, IC-Link by imec Partner on 8-Inch GaN Manufacturing

10/19/2026 | Polar Semiconductor, LLC
Polar Semiconductor, LLC (Polar), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, and IC-Link by imec, imec’s design and manufacturing service, announced they are collaborating to provide 8-inch production of enhancement-mode (e-mode) GaN devices to serve critical markets such as AI data centers, automotive, aerospace & defense, and the industrial grid.

ExpressPCB Plus 3.4 Checks the Whole Board Before You Order

10/19/2026 | ASC Sunstone Circuits
Free update adds full-board design rule checking, restores SnapMagic part downloads, and brings ExpressPCB Classic designs into the new DR

NVIDIA, Chipmakers Advance AI-Defined Fab Design and Manufacturing

10/15/2026 | Globe Newswire
NVIDIA announced semiconductor leaders are adopting NVIDIA CUDA-X™ libraries — including the new NVIDIA cuPotential library, which developers can use to build AI agents that simulate how atoms and molecules interact — to advance AI-defined fabs.

Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.

EDA Market to Reach $34.5B by 2033 on AI and Cloud Growth

10/15/2026 | Globe Newswire
The global Electronic Design Automation (EDA) market is positioned for substantial growth as semiconductor manufacturers and electronics companies address increasingly complex product designs.
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