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The Xen Project, an open source virtualization platform hosted by the Linux Foundation, today announced the Xen Safety Committee, a collaborative initiative for developing and maintaining shared engineering artifacts that support functional safety activities and expand Xen's role across automotive, industrial automation, avionics, robotics, and other safety-critical systems.

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Bert Horner to Present Flying Probe Testing at Dallas SMTA Failure Analysis and Test Information Day

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The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce that its President Bert Horner will share his extensive expertise in electronics manufacturing and test engineering at the Dallas SMTA’s upcoming Failure Analysis and Test Information Day, taking place Friday, September 4, 2026, from 11 a.m.-2:30 p.m. at Aboca’s Italian Grill in Richardson, Texas.

It’s Only Common Sense: The Golden Age of Electronics Manufacturing Has Already Begun

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If you spend too much time reading headlines, you could easily come away believing that manufacturing is struggling, electronics is losing ground, and the best days of our industry are behind us. We hear about supply chain disruptions, labor shortages, geopolitical uncertainty, rising costs, or global competition. It is enough to make even experienced professionals wonder what comes next.

Advanced Electronic Packaging: The Industry's New Innovation Engine

08/13/2026 | Marcy LaRont, I-Connect007
Over the past several years, advanced packaging has moved from the back end of semiconductor manufacturing to becoming one of the electronics industry's most strategic technologies in the ecosystem. At many IEEE conferences, discussions that once centered almost exclusively on transistor scaling now devote equal attention to chiplets, heterogeneous integration, co-design, advanced substrates, thermal management, and system-level packaging.
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