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Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24

11/25/2024 | Compal Electronics Inc.
Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions.

Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens

10/14/2024 | Bransys
Bransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.

NVIDIA Blackwell Platform and ASIC Chip Upgrades to Boost Liquid Cooling Penetration to Over 20% in 2025,

09/23/2024 | TrendForce
TrendForce’s latest reports reveal that the launch of NVIDIA’s Blackwell platform, expected in 4Q24, is set to significantly drive the adoption of liquid cooling solutions. Liquid cooling penetration is projected to grow from around 10% in 2024 to over 20% in 2025.

NVIDIA Blackwell's High Power Consumption Drives Cooling Demands; Liquid Cooling Penetration Expected to Reach 10% by Late 2024

07/30/2024 | TrendForce
With the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024.

Molex Releases Report on Thermal Management Challenges and Opportunities for I/O Modules

05/22/2024 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has published a report that examines thermal management pitfalls and possibilities as data center architects and operators strive to balance high-speed data throughput requirements with the impacts of growing power density and the need for heat dissipation on critical servers and interconnect systems.
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