The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
I-Connect007 Welcomes New Milaero Columnist Jesse Vaughan
February 18, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
I-Connect007 is excited to announce the addition of a new monthly column, “Beyond the Board,” authored by Jesse Vaughan, a seasoned expert in the PCB/milaero sector.
Jesse, a third-generation printed circuit board technologist currently working at Summit Interconnect, brings a wealth of knowledge and passion to our publications.
His new column, “Beyond the Board,” will delve into market and industry trends, workforce engagement, and the processes and technology roadmap within the electronics industry. He will explore a variety of topics, including the future of innovation, electronics and sustainability, how electronics careers are changing the world, breaking stereotypes, and other market trends.
Jesse Vaughan is a third-generation PCB technologist with extensive experience in PCB design, fabrication, assembly, and program management. He has collaborated closely with engineers, manufacturers, and supply chains to deliver high-quality, reliable solutions. Jesse excels at bridging the gap between innovation and manufacturability, optimizing complex board designs, and streamlining production processes. His commitment to advancing PCB technology is evident through his active participation in several IPC committees.
He is currently employed as a senior account manager at Summit Interconnect.
We look forward to Jesse’s insightful contributions and are confident that “Beyond the Board” will become a valuable resource. The first column debuts in the I-Connect007 newsletter MilAero007 Week on Tuesday, Feb. 25.
Share on:
Suggested Items
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/10/2025 | TTCIThe Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Webinar Review: A Global Trade and Economy in Flux
07/09/2025 | I-Connect007 Editorial TeamIn a July 8 webinar, Global Electronics Association Chief Economist Shawn DuBravac provided a comprehensive analysis of the evolving international trade environment, its implications for inflation, monetary policy, and labor dynamics, and a sober assessment of market valuations. In “Navigating a Shifting Landscape” DuBravac painted a picture of a global economy in flux, where shifting trade alliances and tariff structures are redrawing the supply chain map and influencing the broader economic landscape, while also conveying an overall bullish market outlook.
IBIDEN Earns Recognition in FTSE Russell ESG Indexes, Reinforcing Commitment to Sustainable Growth
07/07/2025 | IBIDENIBIDEN Co, Ltd. is pleased to announce that it has been selected for FTSE4Good Index Series for the tenth consecutive year, FTSE Blossom Japan Index for the nineth consecutive year, and FTSE Blossom Japan Sector Relative Index for the fourth consecutive year.
The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
07/08/2025 | Mike Konrad -- Column: The Knowledge BaseIn electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.