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Target Condition: Distribution of Power—Denounce the Ounce

11/05/2025 | Kelly Dack -- Column: Target Condition
Have you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.

Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia

10/31/2025 |
Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/31/2025 | Nolan Johnson, I-Connect007
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.

Standard of Excellence: Speed vs. Quality in Customer Service

10/29/2025 | Anaya Vardya -- Column: Standard of Excellence
The key to a company’s success is excellent customer service. In our industry, with tight deadlines, high expectations, and particularly where customers demand immediate responses, there’s a challenging balancing act between speed and quality. PCB companies—like all businesses serving demanding B2B clients in aerospace, defense, medical, and high-reliability markets—often feel caught between responding quickly and providing accurate, helpful, and meaningful information.

TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand

10/27/2025 | I-Connect007 Editorial Team
TSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.
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