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LQDX, Arizona State University Sign Semiconductor Packaging Collaboration Agreement

02/11/2025 | LQDX
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.

Semi-Solid State Battery Adoption in EVs Gradually Rises, Projected to Exceed 1% Market Penetration by 2027

02/04/2025 | TrendForce
TrendForce’s latest research highlights that semi-solid state batteries—an emerging battery technology combining the advantages of traditional liquid electrolyte batteries and solid-state batteries—entered trial production before 2020.

North American Semiconductor Industry Unites to Address Trade Challenges and Strengthen Resilience

01/31/2025 | PRNewswire
Leading organizations across Quebec and the Northeastern states of the United States have joined forces to address trade challenges and strengthen resilience.

GlobalFoundries Announces New York Advanced Packaging and Photonics Center

01/24/2025 | GlobalFoundries
GlobalFoundries (GF) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility.

StratEdge Partners with Vitale Engineering as Manufacturer's Representative for Upstate New York

01/22/2025 | StratEdge
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach and technical expertise,
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