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Advanced Electronics Packaging Digest

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UCIe Consortium Releases 4.0 Specification for System-Level Integration

11/13/2026 | BUSINESS WIRE
The Universal Chiplet Interconnect Express® (UCIe®) Consortium, the open standards group for interconnects between chiplets within a package, announced the release of the UCIe 4.0 Specification, taking the UCIe architecture beyond chiplet-level interface design to address key requirements for integrating multiple chiplets into a cohesive on-package system.

Amkor Breaks Ground on Expansion in Gwangju

11/11/2026 | Amkor Technology
Amkor marked a new milestone in South Korea with a groundbreaking at in Gwangju. The expansion is the next phase of growth for a site that has been part of Amkor’s Korea operations since the 1990s, and it supports rising demand for advanced packaging in AI and accelerated computing.

EV Group Advances Qubit Scaling Through Advanced Packaging

11/09/2026 | PRNewswire
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is supporting quantum chip developers and manufacturers in addressing the complex manufacturing requirements associated with scaling quantum computing systems.

SEMI Foundation Launches Global Semiconductor Innovation Challenge

11/09/2026 | SEMI
The SEMI Foundation announced the launch of the Chip the Future Challenge™, a new global competition inviting undergraduate and graduate students to bring their ideas, research, and technical creativity to some of the most important opportunities shaping the future of the semiconductor industry.

Seoul Semiconductor Ends Need for Rare Earths in White LEDs Share

10/28/2026 | BUSINESS WIRE
For three decades, white LEDs have depended on rare earth materials such as yttrium aluminum garnet (YAG) layered onto a blue LED chip.
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