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The ICAPE Group Invests in Jiva Materials to Drive Eco-Friendly PCB Innovation in Europe

11/27/2024 | BUSINESS WIRE
ICAPE Group, a global technology distributor of printed circuit boards (“PCB”) and custom-made electromechanical parts, today announced it will be acquiring a minority shareholding in Jiva Materials Ltd, a UK-based innovator and the developer of Soluboard® - the world’s first fully biodegradable PCB substrate.

Siemens’ Solido SPICE Now Certified for Multiple Leading-edge Samsung Foundry Processes

11/27/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that its continued collaboration with longtime customer Samsung Foundry has established a host of new certifications for its recently introduced Solido™ SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP and 3D-IC semiconductor designs. 

Subdued Electronics Industry Sentiment Continues in November

11/25/2024 | IPC
IPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report

VORAGO Technologies, Collabora Partner to Advance Open Source in Space

11/25/2024 | GlobeNewswire
VORAGO Technologies, a leading provider of radiation hardened and radiation tolerant MCUs and MPUs for Aerospace and Defense, and Collabora, a leader in open source software and support, announced they are partnering to advance the use of open source to achieve resilience for mission critical applications in space.

Siemens Unveils Next Generation AI-enhanced Electronic Systems Design Software

11/13/2024 | Siemens
Siemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, HyperLynx software and PADS Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.
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