-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Compal Electronics Reports July 2024 Revenue
August 12, 2024 | Compal Electronics Inc.Estimated reading time: Less than a minute
Compal Electronics announced its consolidated revenue for July 2024. The company reported NT$76.44 billion (USD $2.54 billion) in revenue, representing a 7.5% decrease month-over-month (MoM) and a 9.9% decrease year-over-year (YoY).
For the first seven months of 2024, Compal's accumulated revenue reached NT$513.22 billion (USD $17.11 billion), reflecting a 4.6% decrease YoY.
Suggested Items
Worldwide Smartphone Market Forecast to Grow 6.2% in 2024, Fueled by Robust Growth for Android in Emerging Markets and China
11/27/2024 | IDCWorldwide smartphone shipments are forecast to grow 6.2% year-over-year in 2024 to 1.24 billion units, according to the latest International Data Corporation (IDC) Worldwide Quarterly Mobile Phone Tracker.
WSTS Semiconductor Market Forecast Spring 2024
11/26/2024 | WSTSWSTS has adjusted its Spring 2024 forecast upwards, projecting a 16.0 percent growth in the global semiconductor market compared to the previous year.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Global Notebook Shipments Expected to Grow by 4.9% in 2025, Business Demand Emerges as a Key Driver
11/25/2024 | TrendForceTrendForce reports that the global notebook market in 2024 is projected to recover at a moderate pace, hindered by high interest rates and geopolitical uncertainties.
Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment
11/25/2024 | Real Time with... electronicaIn this interview from electronica 2024, Pete Starkey speaks with Andrea Furnari, VP of Electronic Test Products Business Unit for SPEA. The discussion revolves around AI integration in test equipment, trends in substrate materials, and SPEA's focus on R&D.