-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Flex, Musashi Energy Solutions Partner to Mitigate Utility Power Challenges in AI Data Centers
August 8, 2024 | FlexEstimated reading time: 2 minutes
Flex and Musashi Energy Solutions a group company of Musashi Seimitsu Industry Co., Ltd., announced an extensive collaboration to supply Flex-designed and manufactured Capacitor-based Energy Storage Systems (CESS) featuring Musashi's Hybrid SuperCapacitor (HSC) technology. These systems are designed to integrate with server rack power systems to address significant challenges with utility power in artificial intelligence (AI) data centers. First to market with Musashi's HSC technology, Flex has collaborated with Musashi to develop strategic technology and product development roadmaps for current and future products that enable hyperscale operators to mitigate utility power fluctuations in data centers deploying AI workloads.
Flex's CESS solutions are designed to balance peak power and protect the grid from intense power surges and line disturbances during AI training and inference activities taking place in modern data center environments. Musashi's state-of-the-art HSCs are designed to provide high-reliability energy storage in many applications and are known for their power density, longevity, and reliability. The technology reduces equipment size, weight and total cost of ownership.
Key features of the CESS include:
- The ability to support and balance power supply systems during large power transients
- Efficient energy management and the reduction of large power transients or spikes produced by AI workloads by alternately supplying and absorbing energy in its internal Hybrid Supercapacitors, which are supplied by Musashi
- A significantly longer lifespan than current battery energy storage systems, with ability to provide multi-million charge/discharge cycles – essential for high performance capacity and dependability needed in the data center
- A wide operating temperature and inherent safety through Musashi's Hybrid SuperCapacitors, with cells able to operate in temperature ranges from minus 30 to over 70 degrees Celsius, plus UL 810A certification and completion of UL 9540A testing for thermal runaway at the cell level
"We are proud to lead the charge in powering the next generation of AI innovation alongside Flex to address the power challenges needed to unleash capacity for explosive data center growth," said Frank DeLattre, President of Musashi Energy Solutions in North America. "Our partnership with Flex for its new CESS product will bring reliable, efficient and scalable power solutions to the market. Musashi Energy Solutions continues to invest heavily in future Hybrid SuperCapacitor cell development to meet the future power density demands in AI computing as well as the manufacturing capacity required for customers to meet the forecasted cell volume."
"Our collaboration with Musashi is central to developing our innovative CESS solutions to sustainably support the complex power demands of AI data centers worldwide," said Mattias Jansson, Vice President of Power Solutions at Flex. "Together with Musashi, our technology and innovation portfolio plans enable Flex to provide hyperscale operators with advanced energy storage systems that enable them to address long-term energy transitions. Our CESS solutions are another proof point of how Flex is enabling customers to maximize AI server cluster computing performance and unlock data center capacity as AI applications drive unprecedented growth."
Flex is slated to begin production of its CESS in the first half of Calendar Year 2025, with commercial availability expected within one quarter of production start.
Suggested Items
Würth Elektronik Offers its Radio Module for LoRaWAN Communication
11/19/2024 | Wurth ElektronikWürth Elektronik launches Daphnis-I on the market – a slim, ultra-low power consumption and long range radio module for IoT applications.
RTX's Raytheon Awarded U.S. Army Contract for Wireless Power Beaming Technology
11/18/2024 | Raytheon TechnologiesRaytheon, an RTX, has been awarded a contract from the U.S. Army to work on directed energy wireless power beaming capabilities that will distribute power across the battlefield, simplify logistics, and safeguard locations for U.S. troops.
Boeing Delivers Advanced O3b mPOWER Satellites to Operator SES
11/14/2024 | BoeingBoeing teams have successfully delivered the 7th and 8th O3b mPOWER satellites to SES. These satellites, featuring Boeing’s advanced software-defined communications payload, are being transported to Cape Canaveral for a planned launch in December.
Renesas Jointly Developed World-Class '8-in-1' Proof of Concept with Nidec
11/12/2024 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the world's first “8-in-1” proof of concept* (PoC) for E-Axle systems for electric vehicles (EV), which controls eight functions using a single microcontroller (MCU).
Aismalibar to Showcase Advanced Thermal Management Solutions for Electronics at electronica 2024
11/11/2024 | AismalibarAismalibar, a leading innovator in thermal management solutions, will exhibit at electronica 2024, the world’s foremost trade fair and conference for the electronics industry, held in Munich from November 12-15, 2024. Located at Booth B1.543, Aismalibar will highlight its latest advancements in Thermal Interface Materials (TIMs), Insulated Metal Substrates (IMS), and Thermal FR4 solutions tailored to meet the increasing demands for efficient heat dissipation and durability across various high-power applications.