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Advanced Electronics Packaging Digest

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Suggested Items

SMT Perspectives & Prospects: The Architecture of Winston Churchill’s Leadership

07/22/2026 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
I was recently invited to visit the U.S. Embassy and the Churchill War Rooms in London, where I met Warren Stephens, U.S. ambassador to the UK, and Bank of England Gov. Andrew Bailey. From those modern diplomatic corridors to the stark resolve of a wartime bunker, the experience reminded me that leadership in this ever-shifting global landscape is, at its best, about bridging the wisdom of the past with the realities of the present.

The Right Approach: The Pros and Cons of PCB Vertical Integration

07/21/2026 | Steve Williams -- Column: The Right Approach
Vertical integration in PCB fabrication is a genuinely contested strategic question with real tradeoffs on both sides. The core tension: Fabricators integrate up into design and down into assembly to gain margin and stickiness, but risk diluting their manufacturing focus and alienating the EMS and design-house partners they depend on.

American Made Advocacy: PCBAA’s Fifth Annual Meeting—Growing Membership and Valuable Relationships

07/21/2026 | Shane Whiteside -- Column: American Made Advocacy
The Printed Circuit Board Association of America recently celebrated its fifth anniversary. We began with five member companies that banded together to influence legislation favorable to our industry. Today, we have 90 members across the entire ecosystem: OEMs, fabricators, assemblers, materials providers, testing companies, and applied AI startups. Our membership ranges from companies with long histories to ventures just embarking on their PCB journeys.

Dan’s Biz Bookshelf: ‘The Soul of a New Machine’

07/09/2026 | Dan Beaulieu -- Column: Dan's Biz Bookshelf
Every once in a while, it's worth pulling an old book off the shelf to see if it still has something to teach us. That's exactly what I did recently with Tracy Kidder's Pulitzer Prize-winning "The Soul of a New Machine." I first read it more than 40 years ago when it was considered essential reading for anyone interested in technology and engineering. I wondered if it would still hold up after all these years. More importantly, I wanted to see how much the electronics industry had changed since the late 1970s and early 1980s.

The Test Connection, Inc. Becomes First Test Engineering Company in Space

06/30/2026 | The Test Connection Inc.
TTCI recently contributed engineering time and resources to the Observation & Detection Interpreted by Neural-networks (ODIN) project, a student-developed payload by Capitol Technology University in Laurel, Maryland.
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