Trouble in Your Tank: Yield Improvement and Reliability
Dan's Biz Bookshelf: 'The Sale'
The Marketing Minute: Wired for Trust
SEMICON Europa 2024 Call for Abstracts Opens
May 21, 2024 | SEMIEstimated reading time: 1 minute
SEMI Europe announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor.
Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa 2024 will gather industry-leading experts and innovators to explore cutting-edge technologies, materials, and process advancements driving the digital transformation and growth in the semiconductor industry. The exhibition and conference will be co-located with electronica.
Call for Abstracts – Events
Advanced Packaging Conference ─ Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency
The emergence of new types of neural networks like ChatGPT and other AI applications is driving unprecedented demand for high-performance computing (HPC) and innovations in advanced packaging – including for chiplets – heat dissipation, miniaturization, material integration, and power optimization. Abstracts on topics including growth through innovation, developments in design, manufacturing efficiency, and testing systems are invited.
Fab Management Forum ─ Industry Meets Innovative Ideas
Geared for fab managers, the Fab Management Forum will focus on optimizing next-generation core technologies such as SiC, photonics, and quantum computing to support industry growth. The forum will explore advancements in smart manufacturing solutions that leverage AI-driven tools for efficiency gains to address Europe's environmental sustainability goals and mitigate semiconductor industry-related environmental risks.
MEMS & Imaging Sensors Summit ─ MEMS and Imaging Young Talent
Entrepreneurs, start-up companies, and graduates will showcase their research and early-stage products to MEMS and imaging sensors technologists. Topics of interest include MEMS technologies, new applications and use cases, advancements in MEMS and sensors technology and materials, MEMS-photonics co-integration, and imaging technologies focused on new sensor applications, materials, and architectures.
Pre-recorded Innovation Presentations ─ Innovation and Collaboration: Powering Sustainable Exponential Growth
SEMI Europe will also highlight microelectronics and semiconductors innovations in short pre-recorded messages, pitches and product announcements by technologists. The videos will be aired on SEMICON Europa 2024 main stages during networking sessions and on the final day of the event.
Presentation abstracts, biographies and headshots must be submitted in English on the SEMICON Europa 2024 Call for Abstracts webpage by June 17, 2024. Selected presenters will be notified in August 2024.
Share on:
Suggested Items
COMPUTEX 2025 Concludes Successfully AI Deployment Accelerates as Taiwan Solidifies Its Strategic Global Position
05/23/2025 | PRNewswireCOMPUTEX 2025 concluded today after four days of dynamic exhibitions and events. The show welcomed an impressive turnout, with 86,521 buyers from 152 countries, including Japan, the United States, South Korea, Vietnam, and India.
Explore TRI’s Test and Inspection Solutions at SMTA Ontario Expo 2025
05/23/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join the SMTA Ontario Expo 2025.
TT Electronics' Cleveland Ohio Facility Re-Certified to Aerospace and Defence Standards AS9100 and Nadcap
05/23/2025 | TT ElectronicsTT Electronics has successfully completed recertification of the Cleveland facility to AS9100 and Nadcap standards. This milestone underscores the company’s unwavering dedication to quality in manufacturing for the aerospace and defence sectors, a commitment proudly upheld for more than 15 years.
Advancements in High-reliability Alloys for Automotive and High-performance Applications
05/22/2025 | Barry Matties, I-Connect007At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA Innolot, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.
Zuken Launches CR-8000 2025 with AI-Enhanced Support for High-Speed, High-Density PCB Design
05/21/2025 | ZukenZuken, a global leader in electronic design automation (EDA) solutions, has announced the release of the 2025 updates to its flagship PCB design applications, CR-8000 Design Gateway and Design Force.