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Cadence Recognized as a Platinum Employer on the Where You Work Matters List

03/25/2026 | Cadence Design Systems
We're proud to be named a 2026 Platinum Employer on the Where You Work Matters List. This recognition reflects our commitment to building high-quality jobs and expanding opportunities for our workforce.

Connect the Dots: The Future of Designing for Reality—Pattern Plating

02/05/2026 | Matt Stevenson -- Column: Connect the Dots
Last month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.

Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink

12/29/2025 | Elephantech
Japanese deep-tech Elephantech announced successful development of an innovative process to form High-Density Interconnect (HDI) microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”

Why AI/ML May Be the Next Big Step for PCB Fabs

12/23/2025 | Sydney Xiao, Global Electronics Association East Asia
PCB manufacturing is approaching a pivotal moment across the global electronics supply chain. For decades, the industry grew by adding equipment, expanding capacity, and relying on the accumulated experience of seasoned engineers. Today, the landscape is shaped by rising product complexity, increasingly sensitive material systems, tighter delivery expectations, and a worldwide shortage of technical talent. The traditional model is nearing its limits.

MKS Presents Future-ready PCB Solutions at HKPCA 2025

12/03/2025 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, announced its participation in the HKPCA Show, taking place December 3–5 at Shenzhen World Exhibition & Convention Center. Under its strategic brands, Atotech® – offering process chemicals, equipment, software, and services – and ESI®, known for laser systems, MKS will showcase its latest advancements in printed circuit board (PCB) and package substrate manufacturing.
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