Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Infineon Opens World's Largest Fab for Power and Analog/Mixed-Signal Semiconductors in Dresden

07/02/2026 | Infineon
Infineon Technologies AG opened the Smart Power Fab in Dresden several months ahead of schedule. The new plant, with an investment volume of five billion euros, is the largest single investment in Infineon's history and one of the largest investment projects in Germany, creating 1,000 new, direct jobs.

VisionWave Signs Definitive Agreement to Acquire Controlling Interest in Meteor Aerospace

06/30/2026 | Globe Newswire
VisionWave Holdings, Inc., a defense technology company developing advanced artificial intelligence, autonomous systems and next-generation security technologies, announced that it has entered into a definitive binding agreement to acquire a 51% controlling interest in Meteor Aerospace Ltd., a privately held Israeli aerospace and defense company recognized for its portfolio of advanced unmanned systems, precision defense technologies and integrated national security solutions.

Q/C Technologies Relocates HQ to San Francisco for Photonic Computing Push

06/30/2026 | Globe Newswire
Q/C Technologies, Inc. announced that it has relocated its headquarters to San Francisco, California, as part of its plan to develop a proprietary optical processing unit (OPU) capable of overcoming the heightened performance and energy constraints of today’s artificial intelligence inference infrastructure.

Qualcomm, Hugging Face Expand AI Partnership from Device to Cloud

06/29/2026 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced the expansion of its strategic relationship with Hugging Face to advance open, developer-driven artificial intelligence (AI) from devices to cloud infrastructure.

Imec Achieves Breakthroughs in Ferroelectric Memory Research for AI-Era Data Needs

06/26/2026 | Imec
Ferroelectric memory is drawing increasing attention as AI workloads place unprecedented pressure on memory systems to deliver more capacity, higher bandwidth, and better energy efficiency at sustainable cost.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in