-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
OE-A at LOPEC: Printed Electronics Powers Sustainability
February 6, 2024 | OE-AEstimated reading time: 4 minutes
The “OE-A Competition 2024” shows the many possibilities of flexible, organic, and printed electronics with inspiring products, prototypes, and fresh designs live at LOPEC 2024, the leading international exhibition and conference for flexible, organic, and printed electronics in Munich.
"This year's OE-A Competition impressively demonstrates how printed electronics is the technology to create sustainable electronics through low-energy non-hazardous chemicals, additive manufacturing processes and the use of recyclable materials,” says Dr. Klaus Hecker, Managing Director of the OE-A, an international working group within VDMA. The OE-A (Organic and Printed Electronics Association) is the leading international industry association for the emerging technology of flexible, organic, and printed electronics.
The proof will be provided at LOPEC 2024, the international platform for printed electronics, from March 5 to 7, live at the ICM in Munich. This year, 17 projects from international companies, research institutes and universities are participating in the "OE-A Competition 2024" to present their new products, prototypes, and concepts. The submitted projects will be judged by a jury of representatives from renowned international companies and institutes in three categories: "Prototypes & New Products"; "Freestyle Demonstrator"; and "Publicly Funded Project Demonstrator".
Henkel and OE-A foster young talents
In addition to the established competition, Henkel AG & Co. KGaA and the OE-A Working Group Education have for the first time launched an “Open Innovation Challenge” for graduate and undergraduate students on the topic of Smart Living and Smart Mobility. “Together with our member Henkel, we challenged young students to develop and prototype an innovative idea for a printed electronics application that addresses the Smart Living or Mobility markets. To bring their ideas to life, the students were provided with the Henkel Sensor Kit, which includes 5 types of printed sensors” explains Klaus Hecker. A jury consisting of Henkel, OE-A and other industry representatives will select the winner of the “Open Innovation Challenge”. The winning project will be showcased at the OE-A booth at LOPEC, along with all other OE-A Competition projects.
Enabling more sustainable products
Inspiring printed electronics projects guided by the idea of sustainability participate in this year's OE-A competition. Here a sneak peek into three of them:
IEE from Luxembourg competes with a multifunctional busbar connector for battery packs. This product is designed to reduce battery costs in e-mobility. The solution combines multiple functionalities in a single, flexible, and lightweight busbar "sandwich", that enhances drivetrain electrification. With a single compound, customers have a product that performs multiple functions such as voltage monitoring, cell balancing, temperature sensing, electrical isolation, and busbar connection. The integrated bus bar connection demands less manipulation than would be required with more components. This increases manufacturing efficiency and reduces manufacturing costs.
The CEA research institute in France, in collaboration with its industry partner, contributes a medical device use case with a flexible printed circuit board (PCB) within the EU-funded project ECOTRON. The first generation of the use case (GEN1) demonstrates that a conventional PCB can be replaced with a flexible printed one to create more sustainable healthcare and wearable devices with no compromise on performance. The flexible printed circuit board is produced in an additive manufacturing process that uses less energy and chemicals. The future use case generations will include dismantling technologies (GEN2) and bio-based/recycled materials for substrates and inks (GEN3) developed in the project.
Another approach to a more sustainable future is offered by Fundación Tekniker of Spain with its integrated de-icing system for wind turbine blades. In cold weather, ice build-up on the blades reduces the efficiency of wind turbines. The de-icing system detects ice at the initial stage of formation on the wind turbine blade and eliminates it with an integrated heater. The ice detection sensors and the heating system are printed with conductive inks on continuous fiberglass mats, and this printed fiberglass is embedded in an epoxy/glass composite by infusion. Wind turbine run time is maximized in icy conditions, reducing the need to generate backup power.
Public Choice Award
All visitors are invited to vote for the Public Choice Award at the OE-A booth at LOPEC (this time in the Foyer of ICM, FO.33) on March 6. The winner of the Open Innovation Challenge and the winners of the OE-A Competition will be announced on the evening of Wednesday, March 6, during the LOPEC Get-together & Award Show. In addition, all award winners will present their demonstrators during a web seminar on April 25.
OE-A booth at LOPEC
At the OE-A booth at LOPEC 2024, LOPEC visitors will gain a comprehensive insight into printed electronics applications. A visit to the OE-A booth is also worthwhile to learn about the latest results of the new business climate survey and the activities of the numerous international working groups. "Stop by the OE-A stand in the foyer of the ICM, I promise there will be a lot to discover. We are proud to present all projects of the OE-A Competition and the winning student project of the Open Innovation Challenge. And last but not least, the Public Choice Award needs your voice, so please cast your vote for your favorite demonstrator," concludes Klaus Hecker.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/18/2025 | Andy Shaughnessy, Design007 MagazineIt’s been a busy week in our industry. Never a dull moment! If you’ve been paying attention to our tariff tumult with China and its effect on the stock market, especially if your company does a lot of business with China, you might be tempted to call in a Xanax refill about now. But hang tight. This is still early in the first quarter. This brouhaha serves to underscore our need to manufacture critical laminates and components in the U.S. In this week’s must-reads, we have a potpourri of articles covering tariffs, the next generation of HDI, the three-year anniversary of IPC Mexico, a novel green technology, and emerging design trends.
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
IPC President’s Award: Xaver Feiner
04/17/2025 | Nolan Johnson, SMT007 MagazineThroughout his career, Xaver Feiner, vice president of marketing and sales at Zollner Elektronik, has developed extensive expertise in account management and new business development with a strong focus on the semiconductor industry, aerospace, and industrial electronics. Xaver has cultivated a profound understanding of global markets and remains deeply engaged with the challenges and opportunities presented by digital transformation. Since 2020, he has been an active member of the IPC Europe Advocacy Group, where he is dedicated to advancing the position of the electronics industry and the EMS sector across Europe.
New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor
04/16/2025 | Andy Shaughnessy, Design007The conference portion of IPC APEX EXPO has been providing educational opportunities for attendees since the first show. But recently, show managers decided to expand education onto the show floor.