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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Tower Semiconductor, Innolight Advance AI Optical Technologies

11/11/2026 | Tower Semiconductor
Tower Semiconductor, the leading foundry for high-value analog semiconductor solutions, and Innolight, a leading provider of optical connectivity solutions for data center and AI infrastructure applications, announced their continued collaboration on emerging Near-Package Optics (NPO) applications.

From Wafer-level Inspection to System-level Scaling: A Preview of the November Advanced Electronics Packaging Digest

11/11/2026 | I-Connect007 Editorial Team
From wafer-level inspection and precision dispensing to interconnected computing architectures and electronics designed for extreme environments, the November issue of Advanced Electronics Packaging Digest (AEPD) explores how increasing complexity is driving new approaches to performance, reliability, and process control.

Real Time with... SMTAI 2026: Koh Young's Advances in AI-Assisted Inspection and Customer Support

11/11/2026 | Real Time with...SMTAI
In this interview from SMTAI 2026, Joel Scutchfield discusses how Koh Young is expanding its Americas organization to support growth in AI, data centers, and other electronics markets. He describes AI-assisted programming, Smart Review, and automated feedback tools designed to reduce programming time, limit false calls, and improve production efficiency.

I-Connect007 Welcomes Dr. Cody Schoener as Newest Mil/Aero Columnist

11/09/2026 | I-Connect007
I-Connect007 is excited to welcome Dr. Cody Schoener of Dow as a new monthly columnist for our weekly Mil/Aero Newsletter. His column, Built to Survive, will explore the materials and technologies used to protect electronics in demanding military, aerospace, and aviation environments.

FSQuality in Thailand: From Automotive and Industrial Controls to AI and Optical Modules

11/05/2026 | Tulip Gu, ECIO and Marcy LaRont, I-Connect007
One year after their first visit, the ECIO team returned to FSQuality Co., Ltd.’s Thailand factory to see what had changed over an eventful 12 months. The team was joined by Marcy LaRont following the THECA 2026 event in Bangkok. Having met with FSQuality Chairman Liu Tianming at the show the week before, we were eager to see firsthand how the company has evolved its customer strategy, expanded manufacturing to support AI and optical module applications, and added another new building to further increase its high-end manufacturing capabilities and strengthen Thailand’s growing PCB value chain.
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