Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030

05/09/2025 | IDTechEx
By 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.

TTM Technologies Announces Retirement of Founder and Board Member, Kent Alder

05/09/2025 | Globe Newswire
TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (PCB), announced the retirement of its founder, former CEO and long-serving board member, Kent Alder.

NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving

05/09/2025 | NXP Semiconductor
NXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.

Ericsson, Nokia, ANDREW, and Huawei Take Top Spots in ABI Research’s DAS/DRS Vendors Competitive Ranking

05/07/2025 | ABI Research
Driven by the growing demand for seamless connectivity and 5G readiness, the Distributed Antenna System (DAS) and Distributed Radio System (DRS) market is shifting toward more intelligent, scalable solutions tailored to diverse enterprise environments.

Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications

05/01/2025 | Cadence Design Systems
Cadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in