- 
                                
                        
                         - News
 -  Books
                        
Featured Books
- pcb007 Magazine
 Latest Issues
Current Issue
                                                                                                        The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
                                                                                                        Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
                                                                                                        Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
 - Columns
 - Links
 - Media kit
 ||| MENU - pcb007 Magazine
 
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
October 3, 2025 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
As the industry advances toward increasingly compact and high-performance devices, the demand for precise inspection has never been greater. This downloadable guide explores the pivotal role of metrology in advanced semiconductor packaging, offering expert insights into why True3D inspection is essential, how Koh Young’s advanced metrology platforms are redefining accuracy, and what the future of dimensional measurement holds for technologies such as System-in-Package (SiP), Fan-out Wafer-Level Packaging (FOWLP), and 3D stacked dies.
Key topics covered include:
- The evolution of SMT and semiconductor inspection
 - Precision solder and flux inspection with the Meister S and S+
 - Die- and component-level analysis with the Meister D and D+
 - AI-powered wafer-level metrology with ZenStar
 - Flux and underfill inspection with Neptune C+
 - Bridging SMT and semiconductor QA with the Zenith series
 - Smart factory integration and the future of dimensional metrology
 
“With advanced packaging driving the next wave of electronics innovation, accurate measurement is the foundation for ensuring connectivity, reliability, and long-term performance,” said author Brent Fischthal. “This guide is designed to help process engineers and manufacturers understand the inspection challenges they face today—and prepare for those just around the corner.”
The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages is available now as a free download on the I-Connect007 platform.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.