-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Lean vs. TQM vs. Six Sigma
August 2, 2023 | Steve Williams, The Right Approach Consulting LLCEstimated reading time: 1 minute
Introduction
Lean, Total Quality Management (TQM), and Six Sigma are three popular methodologies used in business and manufacturing sectors to improve processes, increase efficiency, and reduce waste. While they share some similarities, each approach has its unique focus and tools. Here's a comparison of Lean, TQM, and Six Sigma.
The Founding Fathers
Companies like Toyota are often touted (with good reason) as the gold standard for quality system models. Toyota’s TPS (Toyota Production System) has been highly publicized and has gained increasing acceptance in American manufacturing operations over the last decade or so. What has not been highly publicized is the fact that many of these concepts originated in America, and quality pioneers like W. Edwards Deming had to take their show on the road to Japan only after being rejected by the leaders of American industry. The contributions of such legends as Dr. Deming, Dr. Joseph Juran, Philip Crosby, Dr. Kaoru Ishikawa, Dr. Walter Shewhart, and Shigeo Shingo had such an impact on the world that they truly are the Founding Fathers of modern quality.
“We strive to decide our own fate. We act with self-reliance, trusting in our own abilities. We accept responsibility for our conduct and for maintaining and improving the skills that enable us to produce added value.”
–Excerpt from Toyota Motor Corporation’s internal document, “Toyota Way”
Lean
Lean is a methodology and philosophy that originated from the Toyota Production System (TPS) and is widely used in various industries for process improvement and waste reduction. The core principle of Lean is to maximize value for customers by minimizing or eliminating non-value-added activities or waste. The primary focus of Lean is on creating flow and eliminating waste throughout the entire value stream, from the beginning of a process to its end. Waste, also known as "Muda" in Lean terminology, refers to any activity or process step that does not add value from the customer's perspective. Figure 1 illustrates the eight types of wastes identified in Lean Manufacturing.
To read this entire article, which appeared in the July 2023 issue of PCB007 Magazine, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Smart Automation: The Journey of a Component Through an SMT Factory
04/22/2026 | Josh Casper -- Column: Smart AutomationIn electronics manufacturing, the SMT line tends to get most of the attention. Placement machines, inspection systems, screen printers, and reflow ovens often take center stage when discussing productivity improvements or new equipment investments. While these systems are obviously critical to the manufacturing process, they only represent a portion of the journey every component takes before becoming part of a finished assembly.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.