-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Cadence’s Allegro X AI Offers 10X Reduction in Turnaround Time
April 6, 2023 | Cadence Design Systems, Inc.Estimated reading time: 1 minute

Cadence Design Systems has announced the Cadence Allegro X AI technology, a next-generation system design technology that offers revolutionary improvements in performance and automation. The new AI offering is built on and accessed through the Allegro X Design Platform and offers transformative time savings for PCB design, with placement and routing (P&R) tasks reduced from days to minutes and with equivalent or higher quality compared with manually designed boards.
P&R in PCB design is traditionally a manual time-intensive process that impacts time-to-market. The Allegro X AI technology leverages the scalability of the cloud for physical design automation, offering generative design of the PCB while ensuring the design is electrically correct and manufacturable. The new technology automates placement, metal pouring, and critical net routing, and is integrated with fast signal integrity and power integrity analysis. Using the generative AI capabilities, customers can streamline their system design process achieving a 10X or more reduction in PCB design turnaround time.
The Allegro X AI technology enables the following benefits:
- Improved Productivity: Dramatic reduction in design turnaround time by automating placement, leveraging a scalable architecture that uses compute infrastructure on the cloud.
- Better Quality of Results: Placement automation using generative AI enables feasibility analysis in the early phases of design. Exploring a much larger solution space than what is possible through manual methods, the technology drives optimization of metrics such as shorter wire lengths while adhering to the design constraints.
- Efficient Design Closure: Integrated tightly with system analysis technologies through the Allegro X Platform where the user can optimize the designs for electrical and thermal performance.
“Cadence is committed to delivering system design solutions that incorporate the power of AI and cloud technology to ensure the fastest turnaround times,” said Michael Jackson, corporate vice president of R&D at Cadence. “The new Allegro X AI technology extends Cadence’s technology leadership in PCB design and provides a transformative impact, offering customers greater productivity through AI-powered automation, improved engine performance and integration with Cadence’s system design and analysis product portfolio.”
The new Allegro X AI technology supports Cadence’s Intelligent System Design strategy, which enables customers to accelerate system innovation. Customers can learn more at www.cadence.com/go/AllegroXAI.
Suggested Items
TDK Demonstrates the World's First ‘Spin Photo Detector’ Capable of 10X Data Transmission Speeds for the Next Generation of AI
04/16/2025 | PRNewswireThis new device is expected to be a key driver for implementing photoelectric conversion technology that boosts data transmission and data processing speed, particularly in AI applications, while simultaneously reducing power consumption.
Real Time with... IPC APEX EXPO 2025: Technological Advancements – IPC's Vision for 2025
04/16/2025 | Real Time with...IPC APEX EXPONolan Johnson introduces Matt Kelly, the CTO and VP Standards & Technology at IPC, who shares insights on recent organizational changes. He highlights the importance of proactive standards development to match the rapid pace of technology, predicting a tenfold acceleration in advancements over the next five years. IPC's core initiatives for 2025 focus on design, advanced electronics packaging, and digital manufacturing, aiming to create new guidelines and standards that meet industry demands.
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
04/15/2025 | SEMIThe 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.
Rocket Lab Onramped to Multi-Billion Dollar U.S. and U.K. Defense Contracts
04/15/2025 | BUSINESS WIRERocket Lab USA, Inc., a global leader in launch services and space systems, announced it has been selected to provide hypersonic test launch capability with its HASTE launch vehicle, engineering expertise, and other services through its participation in two multi-billion dollar government development programs for the United States and the United Kingdom.
Hon Hai Product Chief Xiao Caiyou Elected as Member of the Board of Directors of the NAM
04/15/2025 | Hon Hai Technology GroupHon Hai Technology Group, the world’s largest technology manufacturing and service provider, announced that Jerry Hsiao, Chief Product Officer and General Manager of the U.S. Regional Headquarters, has been invited by the National Association of Manufacturers ( NAM ) to officially join the NAM Board of Directors to help promote the competitiveness of the U.S. manufacturing industry and related policy initiatives.