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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.

From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.

Aeronix Launches First Picatinny CLIK Solution for Unmanned Payload Integration

10/08/2026 | PRNewswire
Aeronix is the first company to demonstrate a true end-to-end CLIK capability implemented to the standard.

Federal, Mossberg, Palladyne AI Launch Autonomous SwarmShot Counter-UAS System

10/08/2026 | BUSINESS WIRE
Federal Ammunition, part of The Kinetic Group, a member of CSG Group; Mossberg; and Palladyne AI Corp., announced the joint development of SwarmShot™, a modular autonomous airborne counter-unmanned aircraft system (C-UAS) designed to transform compatible drones into reusable air-to-air interceptors operating together as a collaborative kinetic defensive swarm.

Global Electronics Association and Fraunhofer Group for Microelectronics Sign MoU to Support Advanced Packaging Industrial Adoption

09/30/2026 | Global Electronics Association
The Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing.
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