Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

The Right Approach: The Pros and Cons of PCB Vertical Integration

07/21/2026 | Steve Williams -- Column: The Right Approach
Vertical integration in PCB fabrication is a genuinely contested strategic question with real tradeoffs on both sides. The core tension: Fabricators integrate up into design and down into assembly to gain margin and stickiness, but risk diluting their manufacturing focus and alienating the EMS and design-house partners they depend on.

Flex, Cerebras Expand Partnership to Scale American Manufacturing of Cerebras AI Supercomputers

07/13/2026 | Flex
Flex and Cerebras Systems Inc. announced an expanded manufacturing partnership to scale production of the Cerebras CS-3, one of the world's most advanced AI accelerator systems, at Flex manufacturing facilities in Milpitas, California.

GlobalFoundries Qualifies SLATE Packaging on 9SW Platform for RF Applications

06/26/2026 | GlobalFoundries
Manufactured at GF’s 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027.

Imec Achieves Breakthroughs in Ferroelectric Memory for AI-Era Needs

06/22/2026 | Imec
At the 2026 IEEE / JSAP symposium on VLSI Technology & Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents two advances in ferroelectric memory research, targeting both ferroelectric capacitors and ferroelectric field-effect transistors as emerging candidates to enable low-voltage operation and high-density integration.

Intel Names New Leader at Intel Foundry to Accelerate Manufacturing

06/22/2026 | Intel
Intel Corporation announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in