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XDry Announces 15th Anniversary of Pioneering Humidity-Controlled Storage
January 6, 2023 | XDry Corp.Estimated reading time: Less than a minute

XDry Corp., a leading supplier of humidity-controlled storage cabinets for electronic manufacturing, laboratories and preservation, celebrates its 15-year anniversary in 2023. Founder Kevin McCarten was an early pioneer in the design of humidity-controlled storage – also known as auto-electronic desiccator storage cabinets.
Today, the company has a corporate headquarters in Dallas, Texas, with authorized distributors in Bangkok, Thailand and all of Europe. XDry’s cabinet environment can be maintained from ambient to 1% RH, providing constant and stable storage at precisely the required RH level. XDry storage cabinets satisfy standards such as IPC/JEDEC J-STD-033 and IPC/JEDEC J-STD-020.
“Fifteen years is a great accomplishment, but knowing our first-year dry storage cabinets are still in operation is an even bigger one,” stated Scott Fillebrown, President of XDry. “We have made great strides in the last couple years with US based inventory and a spare parts depot that typically ships the same day. We are excited to see what the next 15 years will hold.”
As a dry cabinet manufacturer, XDry offers a wide selection of dry cabinets to choose from, including storage for printed circuit boards, moisture sensitive devices (MSD), optics, laboratory equipment, industrial equipment, collectables, media and more.
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Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.