Seika Offers McDry Cabinets with Data Loggers
October 21, 2022 | Seika MachineryEstimated reading time: Less than a minute

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to offer McDry cabinets with Data Loggers as an option. Secure, cloud-based data storage, and multiple unit monitoring are just a few features of the Data Loggers.
By adding a Data Logger to McDry cabinets, users can schedule recurring reports right to your inbox. Also, get email, text and phone alerts when temperature or humidity is out of specification. Charts are downloadable as evidence for traceability, and Data Loggers are Ethernet based, Wifi and networking capable.
The McDry high performance dry cabinet maintains one percent RH levels and quickly recovers back to set point 2-3 times faster than previous model. All McDry ultra-low humidity storage cabinets conform to IPC/JEDEC J-STD 033C and IPC 1602 Standards. Additionally, the ESD safe design adheres to the IEC-61340-5-1 (ESD) Standard. McDry cabinets dehumidify ICs to prevent micro-cracking and are an alternative to baking, MBBs and nitrogen storage.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.