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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Thermoreflectance and Solving the Thermal Puzzle in 3D Packaging

06/11/2026 | Marcy LaRont, I-Connect007
Advanced packaging and 3D heterogeneous integration are rapidly redefining the next phase of the semiconductor industry, delivering unprecedented performance gains while posing significant thermal management challenges. In this interview, Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex packages, interposers, and TSV structures.

The Marketing Minute: AI Is Watching Your Marketing Habits

06/10/2026 | Brittany Martin -- Column: The Marketing Minute
Last summer, I decided I wanted to get better at skateboarding. I had no aspirations of becoming the next Tony Hawk; I simply wanted to feel more comfortable on the board. Like many people learning a new skill, I wanted progress to happen fairly quickly. It didn't. For weeks, every ride felt awkward. Then one day, I realized I wasn't thinking as much. I had better balance, and I felt more natural on the board. Progress had been accumulating through repetition. I've been thinking about that lesson recently because it reminds me of marketing, particularly as generative AI begins to change how customers discover companies and products.

SEMI Reports Global Semiconductor Equipment Billings Increased 14% YoY in Q1 2026

06/05/2026 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that global semiconductor equipment billings increased 14% year-over-year to US$36.55 billion in the first quarter of 2026.

EC Unveils Chips Act 2.0 at SEMI Europe Forum to Boost Semiconductor Innovation

06/04/2026 | SEMI
The European Commission officially presented the new European Chips Act 2.0, marking a major step forward in Europe’s ambition to strengthen its semiconductor competitiveness, resilience and technological sovereignty.

Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0

06/04/2026 | Global Electronics Association
The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package.
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