Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Cicor, CSEM Partner to Accelerate Medical Device Innovation

11/12/2026 | Cicor
Cicor Group and the Swiss technology innovation centre CSEM have entered a strategic, non-exclusive partnership to accelerate the development of medical devices and wearable health technologies.

Teradyne Introduces Omnyx Edge, Inline Board Test for Physical and Edge AI

11/12/2026 | Teradyne
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, introduced Omnyx Edge, an inline board test platform for physical and edge AI.

Infleqtion UK to Develop Deployable Quantum RF Direction-Finding System

10/13/2026 | BUSINESS WIRE
Infleqtion, a global leader in quantum computing and quantum sensing powered by neutral-atom technology, has been awarded £9 million (~$12M) by Innovate UK, part of UK Research and Innovation (UKRI), to continue development of a deployable quantum radio frequency (QRF) direction finding (DF) system as part of the Quantum Missions Primer programme.

Ignium Acquires Action Manufacturing Company

10/05/2026 | BUSINESS WIRE
Ignium LLC announced the acquisition of Action Manufacturing Company. Action is a leading supplier of fuzing and target-sensing ordnance, supporting U.S. and allied priorities in precision strike, counter-UAS, and long-range fires.

FCT Introduces Liquid Leak Detection Flex Assembly for AI and High-Performance Computing Systems

09/21/2026 | Flexible Circuit Technologies
Flexible Circuit Technologies Inc. (FCT) is pleased to announce the development of its Liquid Leak Detection Flex Assembly, a custom-engineered sensing solution designed for liquid-cooled AI servers, high-performance computing (HPC) systems, cold plates, manifolds, quick disconnects, coolant distribution units (CDUs), and other mission-critical electronics.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in