Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Safer Chemistry, Shifting Rules: What’s Next for Electronics Manufacturers?

10/28/2026 | Kelly Scanlon and Brendan Galloway, Global Electronics Association
At the Chemical Watch Regulatory Summit North America 2026, we spent much of our time in different rooms. Kelly followed the chemicals management for electronics discussions, while Brendan focused primarily on chemical control. Yet a common concern emerged across both tracks: Companies are navigating a fragmented regulatory landscape while trying to maintain compliance, introduce new technologies and advance safer chemistry. Our perspectives reflect two sides of that challenge, how manufacturers respond to changing requirements, and how policy can support or complicate their progress.

Stop Inspecting AI and Start Understanding

10/20/2026 | Sean Patterson, CrossGen AI
If you are new to a PCB shop, there is a good chance your first real job is at the back end of the line. Maybe you run the AOI station or pull boards at final inspection and flag the ones that do not pass. I want you to notice something: Every board you reject has already been built. The copper was plated and the layers pressed before you ever saw it. Your job is to catch the mistake, not to stop it from happening. That is a problem, but not with you. Unfortunately, it has always been the way most shops go about achieving quality.

The Need for Speed in Mil/Aero Manufacturing

10/20/2026 | Marcy LaRont, I-Connect007 Magazine
Military and aerospace manufacturers are being asked to move faster, whether developing new drone technologies, responding to supply constraints, or getting new designs from prototype to production. James Hofer of Accurate Circuit Engineering sees that pressure as changing more than just manufacturing schedules. He talks about the growing role of quick-turn PCB fabrication, new relationships between defense primes and startups, and why even long-established approaches to standards and manufacturing have to become more adaptable.

Siemens Advances AI Chip Lithography with NVIDIA cuLitho

10/15/2026 | Siemens
Siemens announced significant advances in its collaboration with NVIDIA to accelerate computational lithography workflows.

Nordson Test & Inspection Wins 2026 Mexico Technology Award

10/14/2026 | Nordson Test & Inspection
Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, announced that its Nordson Sight™ Software Process Control Platform received a 2026 Mexico Technology Award in the Software Process Control category.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in