Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Happy’s Tech Talk #49: Stop! Do You Have a Digital Strategy for the Future?

08/11/2026 | Happy Holden -- Column: Happy’s Tech Talk
I am sure you have been wondering how you will survive this new age of AI, tariffs, China, and the ever-increasing cost of materials and PCB equipment. You cannot just sit back and watch it roll over you. If you wish for your company to survive, you need a “digitalization strategy,” and that includes a way to afford it.

TopLine Ships JEDEC Matrix IC Trays and Waffle Packs from Stock

07/30/2026 | TopLine
TopLine ships a complete range of JEDEC Matrix IC trays and Waffle Packs for a wide variety of components, from stock, eliminating long wait times for components, including BGA, QFN, QFP, PLCC, TSOP, and many others.

SEMI Urges Congress to Extend Section 48D Tax Credit

07/23/2026 | SEMI
SEMI, the global industry association serving the semiconductor and electronics design and manufacturing supply chain, brought together executives from member companies for advocacy meetings on Capitol Hill focused on extending the tax credit for investments in building up the U.S. semiconductor ecosystem.

EU Clears €659 Million for German Semiconductor Expansion

07/21/2026 | I-Connect007 Editorial Team
The European Commission has approved €659 million in German state aid for four semiconductor manufacturing projects, continuing Europe's broader effort to strengthen regional semiconductor production and reduce dependence on overseas suppliers.

The Test Connection, Inc. Becomes First Test Engineering Company in Space

06/30/2026 | The Test Connection Inc.
TTCI recently contributed engineering time and resources to the Observation & Detection Interpreted by Neural-networks (ODIN) project, a student-developed payload by Capitol Technology University in Laurel, Maryland.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in