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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Koh Young Furthers Offerings in Conformal Coating Inspection
November 23, 2021 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute

Joel Scutchfield, general manager of SMT business operations and director of sales at Koh Young, talks with Nolan Johnson about Koh Young’s newest conformal coatings inspection offerings. They also discuss how changing customer needs are creating expansion into new inspection applications. Scutchfield also announces an organizational change.
Listen to this Real Time with… SMTAI 2021 interview with Joel Scutchfield now.
If you didn’t make it to SMTA International in Minneapolis, don’t worry. We have interviews with the SMT segment’s top engineers and managers. Visit realtimewith.com now for all the interviews produced by I-Connect007 in partnership with SMTA at this year's event.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025
08/11/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025.
TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025
08/08/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025.
ViTrox Americas to Showcase Advanced SMT Inspection and Smart Factory Solutions at SMTA Michigan and Ohio Expos
08/07/2025 | ViTroxViTrox Americas Inc. is pleased to announce its participation in the SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, Ohio.
ViTrox Unveils Smart 3D AOI Solutions, Pioneering Dual-Sided Inspection and Robotic Vision Solutions for Back-end Assembly Processes
08/04/2025 | ViTroxViTrox, which strives to be the World’s Most Trusted Technology Company, proudly announces the launch of its new-generation innovations in Automated Optical Inspection (AOI) technology for back-end assembly processes.