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Koh Young Launches the Meister D+ for Semiconductor Package Inspection to the Americas Market
October 13, 2021 | Koh YoungEstimated reading time: 2 minutes
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution. Premium True3D™ Inspection Solution for Chiplets and System-in-Package (SiP) devices including die and surface mount components. The new Meister D+ is an extension of the Meister product family that features solutions ranging from solder paste, printed bumps, and solder ball to small components like 0201Ms and highly reflective die.
Meister D+: Industry Leading Inspection Systems for Advanced Packaging and Semiconductor Applications
As advanced packages continue evolving, device thickness is paramount since consumers demand smaller products with more functionality. As such, the die must be thinned, which creates a mirror-like surface that challenges optical inspection due to its highly reflective surface. Additionally, tight interspacing and increasing aspect ratios further complicate inspection. Yet, as the name implies, the Meister D+ dominants these challenges with industry leading True3D measurement accuracy and inspection technologies.
The latest Meister D+ system is perfected for component and die inspection, while delivering fast, accurate inspection from an 8-projector probe. It targets MCM/SiP/Chiplet inspection with integrated measurement and defect analysis software built on a proprietary AI engine. Beyond 0201M (008004) microchips, 10um bump height, and 5um gap spacing, it detects die defects like micro-cracks, chippings, and foreign material with high accuracy/repeatability. Additionally, this 3D solution supports a wide range of inspection capabilities: missing, offset, rotation, polarity, dimension, co-planarity, and more.
With its Moiré technology, new 12MegaPixel/5-micron optics, and 300mm^2/second inspection speed, the Meister D+ is the first solution for production-speed 3D inspection for modules combining microchips and mirror-finish die. With its user-friendly GUI and programming wizards, it virtually eliminates fine-tuning and teaching, which quickens the production ramp. Plus, its IPC-CFX-2591, IPC-HERMES-9852, and IPC-DPMX-2581 compatibility makes connectivity simple and secure.
With innovative technologies, Meister D+ delivers best-in-class performance and functionality. Its inspection capabilities have already been qualified for mass production by major semiconductor companies throughout the world. The recognized leader in electronics measurement and inspection, Koh Young continues to deliver solutions for the electronics manufacturing industry.
To learn more about our award-winning technologies from Koh Young, visit us at SMTA International in booth 3319. As the Premiere Sponsor for SMTA International, Koh Young America is excited to reconnect and collaborate in-person, while ensuring COVID safety protocols are implemented and upheld for your health and ours. You can register to attend the in-person conference and exposition at smta.org. If you cannot attend, you can still learn more about our best-in-class inspection solutions at our regional website www.kohyoungamerica.com.
Be sure to check out the free 12-part Webinar Series Converting Process Data Into Intelligence, presented by Koh Young experts Joel Scutchfield and Ivan Aduna and download Koh Young's free eBooks The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond published by I-Connect007.
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