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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Microchip Technology Acquires VORAGO Technologies

10/09/2026 | Globe Newswire
Microchip Technology Incorporated, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced that it has acquired VORAGO Technologies, Inc., a privately held provider of radiation-hardened and radiation-tolerant microcontrollers (MCUs) and microprocessors (MPUs), based in Austin, Texas.

Applied Materials, Intel Collaborate on AI Chipmaking Innovations

10/08/2026 | Globe Newswire
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, announced it is working with Intel Corporation to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.

Elephantech to Open Toyosu Advanced Packaging Center

10/08/2026 | Elephantech
Elephantech Inc. announces plans to commence operations at its new Toyosu Advanced Packaging Center (Toyosu APC) in March 2027.

PCB Technologies to Acquire Gorilla Circuits for US$120M

10/08/2026 | PRNewswire
PCB Technologies a global provider of advanced printed circuit boards (PCBs), PCBA, and microelectronics solutions, announced it has entered into a definitive agreement to acquire 100% of the shares of Gorilla Circuits, a leading provider of PCB fabrication and electronic card assembly (PCBA) services based in Silicon Valley.

Infineon Completes Acquisition of C2i Semiconductors

10/07/2026 | Infineon
Infineon Technologies AG announced the completion of its acquisition of C2i Semiconductors, a Bengaluru-based technology company specializing in software-defined multiphase controllers and smart power stages for AI data center applications.
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