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Advanced Electronics Packaging Digest

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Suggested Items

CEA-Leti, GlobalFoundries Advance European FD-SOI Innovation via FAMES Pilot Line

06/11/2026 | CEA-Leti
CEA‑Leti, a leading European research institute for microelectronics, reaffirmed its long‑standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two decades of joint work on fully depleted silicon‑on‑insulator (FD‑SOI) technology and reinforcing Europe's leadership in energy‑efficient, sovereign semiconductors.

Bose Announces Acquisition of StreamUnlimited Engineering GmbH

06/09/2026 | PRNewswire
Bose Corporation, a global leader in audio innovation and research, announced today it has acquired StreamUnlimited Engineering GmbH.

PCB Technologies to Exhibit at IMS 2026 in Boston

06/05/2026 | PCB Technologies Ltd.
Issey Ende, VP of Sales and Marketing for PCB Technologies, has announced that the company will be exhibiting at IMS 2026, (IEEE International MTT Symposia) the world’s leading event for the RF, microwave, and high-frequency electronics industry, taking place June 7th through June 13th, 2026, at the Thomas M Menina Convention and Exhibition Center in Boston, Massachusetts.

American Standard Circuits to Exhibit at IMS 2026 in Boston

06/02/2026 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits, has announced that the company will be exhibiting at IMS 2026, the world’s leading event for RF, microwave, and high-frequency technologies, taking place June 8th through June 13th, 2026, at the Thomas M. Menina Convention and Exhibition Center in Boston, Massachusetts.

QTREX Secures Purchase Order from U.S. Fortune 500 Company for AME System

06/02/2026 | Globe Newswire
QTREX Quantum Ltd.  a company focused on advancing Additively Manufactured Electronics (AME) for quantum computing infrastructure, announced that it received a purchase order from a Fortune 500 multinational company for an AME system and related materials.
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