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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Winners of Philippine Hand Soldering Competition 2026 Announced

10/28/2026 | Global Electronics Association
The Global Electronics Association held its Philippine Hand Soldering Competition during the 21st Philippine Semiconductor and Electronics Convention and Exhibition (PSECE), held from October 26–28, 2026, at the SMX Convention Center Manila in Pasay City.

Rehm Thermal Systems Introduces Vision RCC

10/28/2026 | Rehm Thermal Systems
Rehm Thermal Systems has launched the new Vision RCC, an innovative reflow soldering system specifically developed to meet the requirements of heavy and complex electronic assemblies.

Why Laser Soldering Gets So Much Attention

10/28/2026 | Nolan Johnson, SMT007 Magazine
Production soldering techniques that persist on the shop floor each have their own unique advantages. For complete board assemblies with standard joints and built-in volume, convection reflow is a perennial choice. For through-hole joints, the solution is wave soldering. A relatively small number of solder joints may justify robotic or human hand soldering, but another soldering technique that seems to be gaining prominence is laser soldering.

SEHO Introduces SelectLine-S: German Engineering for the Asian Electronics Market

10/22/2026 | SEHO Systems GmbH
SEHO Systems GmbH will introduce the SelectLine-S, a new selective soldering machine, at NEPCON Shenzhen 2026, taking place October 27–29 in Shenzhen, China.

October SMT007 Magazine Examines Automotive Soldering Reliability

10/01/2026 | I-Connect007 Editorial Team
The October 2026 issue of SMT007 Magazine is now available. As automakers add more electronics while maintaining high production volumes, the stakes for reliable electronics assembly continue to rise. Every added board, sensor, and control system must perform consistently under demanding conditions.
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