It’s Only Common Sense: Being Your Customer’s Expert—The Key to Consultative Sales
The Chemical Connection: Surface Finishes for PCBs
The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
BridgeComm Advances Ultra High-Throughput Connectivity With MOCA Technology
September 23, 2020 | Business WireEstimated reading time: Less than a minute
BridgeComm, Inc., a leader in optical wireless communications (OWC) solutions and services, announced significant achievements in the advancement of OWC with the on going maturity of its Managed Optical Communication Array (MOCA) hardware and software technology. Validated by a partnership with an independent third party, MOCA technology allows for multi-domain capabilities to share large volumes of data and collaborate significantly faster with increased security.
BridgeComm’s MOCA technology enables a point-to-multipoint laser communications solution with a rapidly steerable system that achieves multi-target transmit and receive connections, while significantly reducing the size, weight and power of traditional tracking OWC terminals. The technology is modular and scalable, allowing for rapid development and implementation of terminals suitable for space, air, land and sea domains.
“All the significant functionalities needed for point-to-multipoint and fully meshed communications have been realized in this design,” said BridgeComm CEO Barry Matsumori. “When considering tactical and strategic applications, the features of our MOCA-based terminals provide several key features for multiple simultaneous connections, comms-on-the-move, and networking across platforms with unparalleled security, unlocking point-to-multipoint capability for optical networks.”
Share on:
Suggested Items
Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers
04/11/2025 | AvnetDesign engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.
PCBAIR Invests in AI to Enhance Defect Prediction in PCB Manufacturing
04/11/2025 | PRNewswirePCBAIR, a leading provider of PCB manufacturing and assembly services with fully automated production lines, announced that it is increasing funding for research and development to incorporate AI into its manufacturing processes, dramatically improving defect prediction accuracy and efficiency.
TSMC, ASE Join Forces with 100+ Companies to Drive Silicon Photonics Technology Integration
04/11/2025 | SEMIThe SEMI Silicon Photonics Industry Alliance (SiPhIA) held the Bridging Light & Silicon: SEMI SiPhIA SIGs Kick-off & Seminar today, announcing the official launch of three Special Interest Groups (SIGs) aimed at integrating expertise from various sectors to formulate industry standards and accelerate technological innovation and commercialization.
Cessna Citation CJ4 Gen3 Ushers in 15 Years of Cutting-Edge Aviation Advancements and Technology
04/10/2025 | BUSINESS WIREThe Cessna Citation CJ4 business jet family today achieved a milestone anniversary – the 15-year anniversary of certification, entry into service and first delivery of the aircraft. The latest product investment unveiled for the CJ4, the CJ4 Gen3, is expected to enter into service in 2026.
Sparrow Quantum Secures €21.5 Million to Accelerate Photonic Quantum Innovation in Europe
04/10/2025 | BUSINESS WIRESparrow Quantum, a leading European supplier of photonic quantum chips, has secured €21.5 million in Series A funding to accelerate the development and commercialization of its world-leading quantum chip technology.