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Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers
April 11, 2025 | AvnetEstimated reading time: Less than a minute
Design engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.
Avnet Displays’ new technology solution quickly links STMicroelectronics’ powerful microcontroller solutions to advanced display technology providing a seamless adapter interface.
The technology solution creates a plug-and-play experience that eliminates the typical hurdles in connecting displays to microcontrollers, enabling engineers to focus on innovation rather than interface complexity. The fast and reliable connection provides a secure, high-speed link between STM32 evaluation kits and displays.
The solution is designed to support STM32 microcontrollers and a wide range of display sizes from 4” to 10.1” as well as interfaces. These include the standard options of MIPI (Mobile Industry Processor Interface), RGB (red, green and blue) and SPI (Serial Peripheral Interface) for different applications.
An effortless integration comes with ready-to-use adapters, pre-implemented drivers and optimized software which means reduced development time and lower cost due to lower hardware complexity.
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Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
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LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
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UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.