Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers
April 11, 2025 | AvnetEstimated reading time: Less than a minute
Design engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.
Avnet Displays’ new technology solution quickly links STMicroelectronics’ powerful microcontroller solutions to advanced display technology providing a seamless adapter interface.
The technology solution creates a plug-and-play experience that eliminates the typical hurdles in connecting displays to microcontrollers, enabling engineers to focus on innovation rather than interface complexity. The fast and reliable connection provides a secure, high-speed link between STM32 evaluation kits and displays.
The solution is designed to support STM32 microcontrollers and a wide range of display sizes from 4” to 10.1” as well as interfaces. These include the standard options of MIPI (Mobile Industry Processor Interface), RGB (red, green and blue) and SPI (Serial Peripheral Interface) for different applications.
An effortless integration comes with ready-to-use adapters, pre-implemented drivers and optimized software which means reduced development time and lower cost due to lower hardware complexity.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
KYZEN Honored with 2025 Step-by-Step Excellence Award for Its Innovative ANALYST² Process Control System
10/31/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its ANALYST² Process Control System has won a 2025 Step-by-Step Excellence Award (SbSEA).
LPKF Delivers Key Strategic Technology to Fraunhofer's Glass Panel Technology Group
10/29/2025 | LPKFLPKF Laser & Electronics SE is one of the initiators of the Glass Panel Technology Group (GPTG), a consortium encompassing the entire process chain for advanced semiconductor packaging with glass substrates.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.