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Tianma Orders Kateeva Yieldjet Inkjet Printing System for OLED Display R&D
July 30, 2020 | Globe NewswireEstimated reading time: 1 minute
Kateeva reporta that Tianma Microelectronics Co., Ltd. has ordered a YIELDjet™ EXPLORE inkjet printing system to expand its research and development (R&D) programs for next-generation OLED displays. China-based Tianma is a leading manufacturer of displays used in smartphones, tablet PCs, medical instruments, and more. The company already uses Kateeva’s YIELDjet FLEX tools to mass-produce mobile OLED displays. The new system, which is built for 200mm glass substrates, will be used to develop devices and materials for various new mobile device applications. The tool will be shipped to the customer’s Shanghai facility later this year.
The installation will bring the number of Kateeva printers at customer sites to 60, making it the world’s largest installed base of inkjet tools mass producing OLED applications.
Kateeva developed the YIELDjet EXPLORE tool at its Silicon Valley innovation center to give display leaders a proven system to develop new OLED devices, evaluate advanced materials, and pilot new processes. The EXPLORE product is based on Kateeva’s YIELDjet platform – the world’s first inkjet manufacturing equipment solution built from the ground up to produce OLED displays in high volume. The first product to emerge from the platform was the YIELDjet FLEX system. It is the market leader for flexible OLED mass production. Since its introduction in 2014, the system has been used to manufacture more than 500M display panels in fabs throughout Asia. Today, the vast majority of high-end mobile phones feature displays that are produced by Kateeva tools.
An executive spokesperson at Tianma called Kateeva a valued technology partner and noted, “Tianma continues to benefit from the company’s innovative inkjet equipment solutions, as well as the team’s broad expertise.”
“Tianma is known for integrating industry-leading technologies into their mass-production lines as they relentlessly innovate new displays,” said Kateeva’s CEO, May Su. “The EXPLORE system lets them stretch their innovation aspirations and evaluate the myriad ways their future OLED mass-production processes can benefit from a proven inkjet deposition solution. We’re proud that our technology continues to enable their roadmap.”
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Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
Smart Automation: The Journey of a Component Through an SMT Factory
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Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.