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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Infleqtion UK to Develop Deployable Quantum RF Direction-Finding System

10/13/2026 | BUSINESS WIRE
Infleqtion, a global leader in quantum computing and quantum sensing powered by neutral-atom technology, has been awarded £9 million (~$12M) by Innovate UK, part of UK Research and Innovation (UKRI), to continue development of a deployable quantum radio frequency (QRF) direction finding (DF) system as part of the Quantum Missions Primer programme.

Indium Expert to Discuss Sintering Technology Standardization at IMAPS Autumn Germany 2026

10/13/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will discuss his work to develop industry standards for sintering technologies used in electronics and power electronics at IMAPS Autumn Germany 2026, October 15-16, in Munich, Germany.

I-Connect007 Releases Episode 3 of Qnity Podcast Series, Engineering What’s Next

10/09/2026 | I-Connect007
I-Connect007 is pleased to announce the release of the third episode of Engineering What’s Next, a six-part On the Line With… Qnity podcast series exploring the materials, technologies, and engineering challenges shaping the future of electronics. In this episode, “Rethinking PCB Design for AI Data Centers,” host Marcy LaRont speaks with Dr. Jin Hyun Hwang, business development specialist at Qnity, about how the extraordinary performance and power demands of artificial intelligence are changing the way engineers approach PCB design, materials, packaging, and system architecture.

Microchip Technology Acquires VORAGO Technologies

10/09/2026 | Globe Newswire
Microchip Technology Incorporated, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced that it has acquired VORAGO Technologies, Inc., a privately held provider of radiation-hardened and radiation-tolerant microcontrollers (MCUs) and microprocessors (MPUs), based in Austin, Texas.

Applied Materials, Intel Collaborate on AI Chipmaking Innovations

10/08/2026 | Globe Newswire
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, announced it is working with Intel Corporation to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.
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