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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Boeing Statement on KC-46 Agreement with the U.S. Air Force
April 6, 2020 | BoeingEstimated reading time: Less than a minute
Boeing Defense, Space & Security President and CEO Leanne Caret issued the following statement regarding Boeing’s KC-46 agreement with the U.S. Air Force:
The Air Force and Boeing will make the KC-46 synonymous with aerial refueling excellence. The agreement we announced today takes advantage of new remote vision systems technologies that are orders of magnitude better than what was available when the program started. Generations of women and men in uniform will benefit from the advancements we are making in the science of visualization systems. Not only will these advancements benefit the KC-46 by preparing it for future capabilities like autonomous refueling, they will also benefit other programs for years to come. The investments we continue to make in the KC-46 clearly demonstrate Boeing’s commitment to Pegasus being the standard by which all future refueling aircraft are measured.
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Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
Smart Automation: The Journey of a Component Through an SMT Factory
04/22/2026 | Josh Casper -- Column: Smart AutomationIn electronics manufacturing, the SMT line tends to get most of the attention. Placement machines, inspection systems, screen printers, and reflow ovens often take center stage when discussing productivity improvements or new equipment investments. While these systems are obviously critical to the manufacturing process, they only represent a portion of the journey every component takes before becoming part of a finished assembly.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.