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Advanced Electronics Packaging Digest

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Qnity Expands Thermal Management Solutions for AI Memory Cooling

10/13/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced two new advanced memory cooling solutions leveraging Laird™ Graphite-over-Foam (GOF) and Laird™ Thermal Interface Material (TIM) technologies.

SMTA Launches Advanced Electronics Assembly Technologies Course

10/07/2026 | SMTA
The Surface Mount Technology Association (SMTA) announced a new Advanced Electronics Assembly Technologies course scheduled for November 10-12, 2026 from 9:00 AM to 1:00 PM US Central Time each day. Electronics industry veteran, Keith Bryant, instructs the course live via an online platform.

IPC Standards Support Professional Assessment for the Electronics Competition at WorldSkills Shanghai 2026

10/05/2026 | Global Electronics Association
The 48th WorldSkills Competition was held in Shanghai from September 22 to 27, concluding on September 27. According to the official competition results, Wu Tong of China won the gold medal in the Electronics competition, marking China’s fourth consecutive gold medal in this category.

Xi Electronics Acquires C.J. Rogers Electronics, Continuing a 50+ Year Manufacturing Legacy

10/05/2026 | Xi Electronics
Xi Electronics LLC has acquired C.J. Rogers Electronics, Inc., marking a new chapter for the Southern California electronics manufacturer following more than 50 years under the leadership of founder Carol Rogers.

Incap Romania Expands Cable Assembly Capacity for Electric Bus Project

10/01/2026 | Incap
Incap Electronics Romania has made an investment in a new semi-automatic cable assembly processing system to support a recently awarded multi-year electric bus project with an estimated annual value of EUR 5 million.
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